Indium Corporation Expert to Present sTIMs Solution for AI Thermal Challenges at IEEE ECTC

CLINTON, N.Y., May 13, 2026 — Indium Corporation^® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder thermal interface materials (sTIMs) to address next-generation AI and high-performance computing thermal challenges at the IEEE Electronic Components and Technology Conference (ECTC), May 26-29, in Orlando, Florida.

The presentation, Fluxless Vacuum Formic Acid Reflow of Indium Solder Thermal Interface Materials in Large Area BGA Packages, reveals that indium sTIMs, with 86W/mK thermal conductivity, significantly outperform polymer thermal interface materials (TIMs) through enhanced metallurgical bond capability, and improved thermal cycling performance and reliability. Additionally, vacuum formic acid reflow minimizes voiding—critical for multi-reflow applications like BGA assembly. Research results demonstrate pathways to ultra-low voiding for uniform heat dissipation in demanding next-generation processors and data center applications.

Kyle Aserian is an Applications Development Engineer in the ESM department, specializing in high-performance TIMs and their successful implementation into real-world assemblies. He joined Indium Corporation in 2022 as a Research Associate Scientist, focusing on solder alloy characterization and test method development.

ECTC attendees can attend Aserian’s presentation on May 27 at 11:55 a.m. EDT. To learn more about Indium Corporation’s solder thermal interface materials, visit indium.com or meet with our experts at ECTC booth 240.

Acerca de Indium Corporation

Indium^{Corporation®} es una empresa líder en el refinado, la fundición, la fabricación y el suministro de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Entre sus productos se incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; blancos de pulverización catódica; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y^NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica a nivel mundial y fábricas situadas en China, Alemania, India, Malasia, Singapur, Corea del Sur, el Reino Unido y Estados Unidos.

Para obtener más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected]. También puede seguir a nuestros expertos, From One Engineer To^Another® (#FOETA), en www.linkedin.com/company/indium-corporation/.