Indium Corporation has released m2TIMTM– a new unique solid/liquid hybrid thermal interface material designed to provide ultra-reliable thermal conductivity for heat dissipation.
Indium Corporation’s m2TIMTM combines liquid metal with a solid metal preform. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity.
Other m2TIMTM benefits include:
- Availability in a variety of alloys, including InGa and InGaSn
- Extraordinary wetting ability to both metallic and non-metallic surfaces
- Extremely low interfacial resistance at surfaces
- Eliminated risk of pump-out of the liquid alloy due to absorption by solid solder preforms
For more information about Indium Corporation’s line of thermal interface materials (TIM) products, visit indiumstg.wpenginepowered.com/TIM.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
