Indium Corporation’s Technical Manager Karthik Vijay will present his technical findings at the European Microelectronics and Packaging Conference (EMPC), September 12-15, 2011, in Brighton, UK.
Karthik will present Miniaturization – Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window. This paper describes the development of a flux technology platform to realize print consistency, eliminate head-in-pillow, obtain complete solder coalescence and prevent clumpy solder joints, and achieve very low voiding.
Karthik will also present Power Electronics – Solder TIMs (Thermal Interface Materials) for Improved Thermal Management, which discusses the work done on solder TIMs that have been developed for high-power applications and how they compare to thermal grease.
These papers will be available online at indiumstg.wpenginepowered.com/techlibrary/whitepapers/ after publication at EMPC.
Karthik joined Indium Corporation in 2003. He earned his master’s degree in Industrial Engineering with a specialization in Electronics Packaging & Manufacturing from the State University of New York at Binghamton. He is an SMTA-certified engineer and earned his Six-Sigma Green Belt certification from Dartmouth College’s Thayer School of Engineering.
Indium Corporation will also participate in the exhibition September 13-15. For more information about EMPC 2011, visit www.empc2011.com.
A Indium Corporation é um dos principais fornecedores de materiais para os mercados globais de eletrónica, semicondutores, energia solar, película fina e gestão térmica. Os produtos incluem soldas, pré-formas e fluxos; brasagens; alvos de pulverização; produtos químicos e fornecimento de índio, gálio e germânio; e Reactive NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation visit indiumstg.wpenginepowered.com or email [email protected].
