Indium Corporation’s Technical Manager Karthik Vijay will present his technical findings at the European Microelectronics and Packaging Conference (EMPC), September 12-15, 2011, in Brighton, UK.
Karthik will present Miniaturization – Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window. This paper describes the development of a flux technology platform to realize print consistency, eliminate head-in-pillow, obtain complete solder coalescence and prevent clumpy solder joints, and achieve very low voiding.
Karthik will also present Power Electronics – Solder TIMs (Thermal Interface Materials) for Improved Thermal Management, which discusses the work done on solder TIMs that have been developed for high-power applications and how they compare to thermal grease.
These papers will be available online at indiumstg.wpenginepowered.com/techlibrary/whitepapers/ after publication at EMPC.
Karthik joined Indium Corporation in 2003. He earned his master’s degree in Industrial Engineering with a specialization in Electronics Packaging & Manufacturing from the State University of New York at Binghamton. He is an SMTA-certified engineer and earned his Six-Sigma Green Belt certification from Dartmouth College’s Thayer School of Engineering.
Indium Corporation will also participate in the exhibition September 13-15. For more information about EMPC 2011, visit www.empc2011.com.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料供應商。產品包括焊料、預成型品和助熔劑；钎料；濺鍍靶材；铟、鎵和锗化學品和採購；以及 Reactive NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
For more information about Indium Corporation visit indiumstg.wpenginepowered.com or email [email protected].
