Indium Corporation's Product Support Specialist for PCB Assembly Materials, Brook Sandy-Smith will share her expertise at the SMTA Empire (New York) Expo and Technical Forum on November 8, 2012 at the Radisson Hotel Rochester Airport, in Rochester, NY.
Sandy-Smith's presentation, Proven Approaches to Minimize Voiding under QFNs and other Bottom-Termination Components, discusses the major challenge of eliminating voids underneath components with low standoff. This presentation will explore several approaches to improve assembly of these components, and present results to help optimize thermal performance and reliability.
Sandy-Smith acts as a technical liaison between Indium Corporation customers and internal departments, such as R&D and production, to ensure the best quality and selection of products. Brook attended the University of Rhode Island in the International Engineering Program, and earned degrees in chemical engineering (with a focus on materials) and German language. She also authors a blog, which can be found at blogs.indium.com/blog/brooksandy.
The SMTA Empire Chapter is one in a network of chapters across the United States, South America, the Middle East, and Asia. The volunteer officers and leaders of SMTA Local Chapters plan events serving regional networks of industry professionals. For information on upcoming expos, visit their website at www.smta.org/expos.
A Indium Corporation é um fornecedor de referência de materiais para os mercados globais de eletrónica, semicondutores, energia solar, películas finas e gestão térmica. Os produtos incluem soldas, pré-formas e fluxos; ligas de brasagem; alvos de pulverização catódica; compostos de índio, gálio, germânio e estanho, bem como metais de alta pureza; e Reactive NanoFoil®. Fundada em 1934, a Indium Corporation dispõe de apoio técnico global e fábricas localizadas na China, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite indiumstg.wpenginepowered.com ou envie um e-mail para [email protected].
