Indium Corporation's Product Support Specialist for PCB Assembly Materials, Brook Sandy-Smith will share her expertise at the SMTA Empire (New York) Expo and Technical Forum on November 8, 2012 at the Radisson Hotel Rochester Airport, in Rochester, NY.
Sandy-Smith's presentation, Proven Approaches to Minimize Voiding under QFNs and other Bottom-Termination Components, discusses the major challenge of eliminating voids underneath components with low standoff. This presentation will explore several approaches to improve assembly of these components, and present results to help optimize thermal performance and reliability.
Sandy-Smith acts as a technical liaison between Indium Corporation customers and internal departments, such as R&D and production, to ensure the best quality and selection of products. Brook attended the University of Rhode Island in the International Engineering Program, and earned degrees in chemical engineering (with a focus on materials) and German language. She also authors a blog, which can be found at blogs.indium.com/blog/brooksandy.
The SMTA Empire Chapter is one in a network of chapters across the United States, South America, the Middle East, and Asia. The volunteer officers and leaders of SMTA Local Chapters plan events serving regional networks of industry professionals. For information on upcoming expos, visit their website at www.smta.org/expos.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 공급하는 기업입니다. 주요 제품으로는 솔더, 프리폼 및 플럭스, 브레이즈, 스퍼터 타겟, 인듐, 갈륨, 게르마늄 및 주석 화합물, 고순도 금속, 반응성 나노포일® 등이 있습니다. 1934년에 설립된 Indium Corporation은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 내용은 www.indium.com 또는 이메일 ([email protected])로 문의하세요.
