Comunicados de imprensa

June 11, 2019

Indium Corporation Launches New Low-Temperature Solder Paste

Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean

June 11, 2019

Especialistas da Indium Corporation farão apresentações em aplicações de alta confiabilidade e no seminário SiP

Indium Corporation experts will share their technical expertise at a seminar for Manufacturing and Processes for High-Reliability and System-in-Package Applications on June 14 in

June 6, 2019

Elements of Indium by Indium Corporation: Low Melting Point

In celebration of Indium Corporation's 85th anniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness

June 4, 2019

Indium Corporation to Feature Solder Paste for HIA, SiP at IMAPS Advanced SiP

Indium Corporation will feature its proven solder paste for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at Advanced System in Package

May 30, 2019

Indium Corporation Experts to Present at ICEET

Indium Corporation experts will share their knowledge at the International Conference for Electronics Enabling Technologies (ICEET), June 4-6, Markham, Ontario.  Ed Briggs,

May 23, 2019

A Indium Corporation destaca a pasta de solda à base de ouro

Indium Corporation's line of gold-based solder paste is used in a variety of high-reliability applications. Gold-based solder pastes offer numerous benefits, such as high tensile strength,

May 21, 2019

Especialista da Indium Corporation fará uma apresentação no Seminário sobre Aplicações de Alta Fiabilidade e SiP

Indium Corporation's Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the Manufacturing and Processes for High-Reliability and

May 14, 2019

Indium Corporation Expert to Present at IMAPS Advanced SiP

Indium Corporation’s Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at the Advanced System in Package (SiP) Technology Conference &

May 9, 2019

Indium Corporation Announces Ultrafine 0.006″ (0.15mm) Flux-Cored Wire Capabilities

Indium Corporation announces that it is now offering ultrafine flux-cored wire down to 0.006” (0.15mm) in diameter for standard Pb-free

May 7, 2019

Indium Corporation’s Vareha-Walsh Elected to MMTA Board of Directors

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, has been elected to the Minor Metals Trade Association (MMTA) board of directors and was named interim

May 2, 2019

Indium Corporation Expert to Present at IMS 2019

Indium Corporation expert Seth Homer, Product Manager, Engineered Solders, will present at International Microwave Symposium from June 2-7, in Boston, Massachusetts, USA. Homer

May 1, 2019

Indium Corporation Expert to Present at IW-CIGSTech 10

Indium Corporation expert Malcolm Harrower, Global Sales Manager – Compounds, will share his knowledge on the importance of consistency in high-purity materials at

April 30, 2019

Indium Corporation Experts to Present at ECTC 2019

Two Indium Corporation experts will present at the 2019 IEEE 69th Electronic Components and Technology Conference, May 28-31, in Las Vegas, Nevada. Dr. Ning-Cheng Lee, Vice President of Technology,

April 29, 2019

Indium Corporation to Host Reliability Symposium at SMTA Chapter Events

Indium Corporation, in cooperation with industry partners MicroCare and Weller, is kicking off a half-day, reliability-focused technical symposium roadshow at SMTA

April 25, 2019

Indium Corporation Expert to Present at SMTConnect Technology Days

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will share his knowledge on soldering technologies at SMTConnect Technology Days English Seminar Program,

April 22, 2019

Indium Corporation’s Industry Partners Feature ‘Live@Productronica China’ Demonstrations

Indium Corporation’s industry partners featured its proven products live on the show floor as part of the company’s “Live@Productronica China” program

April 18, 2019

Indium Corporation Launches IndiTri – High-Purity Indium Trichloride

IndiTri™ is Indium Corporation's proven high-purity indium trichloride (InCl3) compound that delivers a consistent percentage of indium with a wide range of applications.

April 17, 2019

Indium Corporation Earns International Automotive Quality Recognition at Solder Manufacturing Facilities

Indium Corporation has earned IATF 16949:2016 management system certificates for five of its solder manufacturing facilities in Clinton and Utica, NY, USA; Singapore; Milton Keynes, UK; and

April 17, 2019

Indium Corporation Interview Among SMT007’s Top 10 Most-Read Articles for March

Indium Corporation’s Chris Nash, Product Manager PCB Assembly Materials, is on SMT007’s list of the Top 10 Most-Read Articles for March for his show floor interview at IPC

April 16, 2019

Indium Corporation Expert to Present at IMAPS New England

Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials, will present on liquid metal interface technology during IMAPS New England 46th Symposium &

April 11, 2019

Indium Corporation to Showcase Technical Content at PCIM Europe E-Mobility Area and Forum

Indium Corporation will showcase material from its vast library of technical content during the E-mobility Forum at PCIM Europe 2019 from May 7-9 in Nuremberg, Germany.