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Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean

Indium Corporation experts will share their technical expertise at a seminar for Manufacturing and Processes for High-Reliability and System-in-Package Applications on June 14 in

In celebration of Indium Corporation's 85th anniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness

Indium Corporation will feature its proven solder paste for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at Advanced System in Package

Indium Corporation experts will share their knowledge at the International Conference for Electronics Enabling Technologies (ICEET), June 4-6, Markham, Ontario.  Ed Briggs,

Indium Corporation's line of gold-based solder paste is used in a variety of high-reliability applications. Gold-based solder pastes offer numerous benefits, such as high tensile strength,

Indium Corporation's Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the Manufacturing and Processes for High-Reliability and

Indium Corporation’s Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at the Advanced System in Package (SiP) Technology Conference &

Indium Corporation announces that it is now offering ultrafine flux-cored wire down to 0.006” (0.15mm) in diameter for standard Pb-free

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, has been elected to the Minor Metals Trade Association (MMTA) board of directors and was named interim

Indium Corporation expert Seth Homer, Product Manager, Engineered Solders, will present at International Microwave Symposium from June 2-7, in Boston, Massachusetts, USA. Homer

Indium Corporation expert Malcolm Harrower, Global Sales Manager – Compounds, will share his knowledge on the importance of consistency in high-purity materials at

Two Indium Corporation experts will present at the 2019 IEEE 69th Electronic Components and Technology Conference, May 28-31, in Las Vegas, Nevada. Dr. Ning-Cheng Lee, Vice President of Technology,

Indium Corporation, in cooperation with industry partners MicroCare and Weller, is kicking off a half-day, reliability-focused technical symposium roadshow at SMTA

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will share his knowledge on soldering technologies at SMTConnect Technology Days English Seminar Program,

Indium Corporation’s industry partners featured its proven products live on the show floor as part of the company’s “Live@Productronica China” program

IndiTri™ is Indium Corporation's proven high-purity indium trichloride (InCl3) compound that delivers a consistent percentage of indium with a wide range of applications.

Indium Corporation has earned IATF 16949:2016 management system certificates for five of its solder manufacturing facilities in Clinton and Utica, NY, USA; Singapore; Milton Keynes, UK; and

Indium Corporation’s Chris Nash, Product Manager PCB Assembly Materials, is on SMT007’s list of the Top 10 Most-Read Articles for March for his show floor interview at IPC

Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials, will present on liquid metal interface technology during IMAPS New England 46th Symposium &

Indium Corporation will showcase material from its vast library of technical content during the E-mobility Forum at PCIM Europe 2019 from May 7-9 in Nuremberg, Germany.