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Indium Corporation Expert to Present at SMTA Upper Midwest Expo & Tech Forum
Indium Corporation’s Dave Sbiroli, Technical Support Manager, will share his industry insight at the SMTA Upper Midwest Expo & Tech Forum, June 27, Minneapolis, Minnesota,
Indium Corporation Expert to Present at CEIA Huizhou Seminar
Indium Corporation’s Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the CEIA Huizhou Seminar on June 27 in Huizhou, China. Liang’s
인디엄 코퍼레이션 전문가, IPC WorksAsia에서 발표 예정
Indium Corporation expert Pony Liao, Area Technical Manager, Northern China will share his technical expertise at IPC WorksAsia Automotive Electronics High-Reliability
Indium Corporation Expert to Present at HiTEN 2019
Indium Corporation’s Bernard Leavitt, Senior Product Specialist, High-Temperature Engineered Solders,will present at the International Conference and Exhibition on High Temperature
Local Companies Host Intern Networking Event
Indium Corporation, CONMED Corporation, Utica National Insurance Group, and Assured Information Security (AIS) joined together to co-sponsor the first annual "Utica Starts
Indium Corporation Launches New Low-Temperature Solder Paste
Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean
고신뢰성 애플리케이션 및 SiP 세미나에서 발표할 인디엄 코퍼레이션 전문가들
Indium Corporation experts will share their technical expertise at a seminar for Manufacturing and Processes for High-Reliability and System-in-Package Applications on June 14 in
Elements of Indium by Indium Corporation: Low Melting Point
In celebration of Indium Corporation's 85th anniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness
Indium Corporation to Feature Solder Paste for HIA, SiP at IMAPS Advanced SiP
Indium Corporation will feature its proven solder paste for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at Advanced System in Package
Indium Corporation Experts to Present at ICEET
Indium Corporation experts will share their knowledge at the International Conference for Electronics Enabling Technologies (ICEET), June 4-6, Markham, Ontario. Ed Briggs,
인디엄 코퍼레이션, 금 기반 솔더 페이스트 강조
Indium Corporation's line of gold-based solder paste is used in a variety of high-reliability applications. Gold-based solder pastes offer numerous benefits, such as high tensile strength,
인디엄 코퍼레이션 전문가, 고신뢰성 애플리케이션 및 SiP 세미나에서 발표 예정
Indium Corporation's Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the Manufacturing and Processes for High-Reliability and
Indium Corporation Expert to Present at IMAPS Advanced SiP
Indium Corporation’s Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at the Advanced System in Package (SiP) Technology Conference &
Indium Corporation Announces Ultrafine 0.006″ (0.15mm) Flux-Cored Wire Capabilities
Indium Corporation announces that it is now offering ultrafine flux-cored wire down to 0.006” (0.15mm) in diameter for standard Pb-free
Indium Corporation’s Vareha-Walsh Elected to MMTA Board of Directors
Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, has been elected to the Minor Metals Trade Association (MMTA) board of directors and was named interim
Indium Corporation Expert to Present at IMS 2019
Indium Corporation expert Seth Homer, Product Manager, Engineered Solders, will present at International Microwave Symposium from June 2-7, in Boston, Massachusetts, USA. Homer
Indium Corporation Expert to Present at IW-CIGSTech 10
Indium Corporation expert Malcolm Harrower, Global Sales Manager – Compounds, will share his knowledge on the importance of consistency in high-purity materials at
Indium Corporation Experts to Present at ECTC 2019
Two Indium Corporation experts will present at the 2019 IEEE 69th Electronic Components and Technology Conference, May 28-31, in Las Vegas, Nevada. Dr. Ning-Cheng Lee, Vice President of Technology,
Indium Corporation to Host Reliability Symposium at SMTA Chapter Events
Indium Corporation, in cooperation with industry partners MicroCare and Weller, is kicking off a half-day, reliability-focused technical symposium roadshow at SMTA
Indium Corporation Expert to Present at SMTConnect Technology Days
Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will share his knowledge on soldering technologies at SMTConnect Technology Days English Seminar Program,
Indium Corporation’s Industry Partners Feature ‘Live@Productronica China’ Demonstrations
Indium Corporation’s industry partners featured its proven products live on the show floor as part of the company’s “Live@Productronica China” program
