Comunicados de imprensa

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, was honored with a Best Paper Award from IMAPS’ 51st International Symposium on Microelectronics,

Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, and Jonas Sjoberg, Associate Director – Global Tech Services, will present at Pan Pacific Microelectronics

Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials, will present on liquid metal interface technology during IMAPS France’s 14th European

Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31. The following technical papers from Indium

Indium Corporation is one of the first soldering materials suppliers to earn IATF-16949:2016 management system certificates for its Global Headquarters and solder paste, flux, and preform

Indium Corporation will observe the 15th anniversary of its “Live@APEX” program in 2019, featuring its proven products live on the show floor throughout IPC APEX

Indium Corporation’s Andy Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will share his expertise at a TechSearch International’s

Indium Corporation’s Fiona Chen, Manager of Research & Development, will deliver a presentation at ELEXCON 2018, December 20-22 in Shenzhen, China. Chen will present on the topic

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry knowledge and expertise at the 2018 Global Minor Metals Forum on Nov. 28 in Kunming,

Indium Corporation earned the Mexico Technology Award for its Indium10.1HF Solder Paste. The Mexico Technology Awards, sponsored by Mexico EMS, recognizes the best

Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the 48th NEPCON Japan, Jan. 16-18 in Tokyo, Japan. Indium Corporation's AuSn

A Indium Corporation apresentará sua série ultra-confiável de pasta de solda Indium8.9HF na IPC APEX EXPO 2019, de 29 a 31 de janeiro, em San Diego, Califórnia,

Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at the ELEXCON 2018,

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead a professional development course during the 20th Electronics Packaging Technology Conference,

Indium Corporation will feature its Die-Attach “Power-Safe” NC-SMQ®75 Solder Paste at China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21 in Hefei, Anhui, China.

Indium Corporation’s, Dr. HongWen Zhang, Manager, R&D Alloy Group, will present at China Semiconductor Packaging Test Seminar (CSPT) 2018 from Nov. 19-21 in Hefei, Anhui, China. It is

Indium Corporation will help attendees Avoid the Void® by featuring its ultra-reliable Indium8.9HF Solder Paste series at SMTA Guadalajara Technical Forum and Expo, Nov.

Two Indium Corporation experts were honored with a Best Paper Award at the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018, October 24-26, in Taipei, Taiwan.

Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at the 20th Electronics Packaging Technology

Indium Corporation expert Iván Castellanos, Technical Services Manager, Latin America, will teach two SMTA Certification courses on SMT Processes this fall.  

Indium Corporation will feature its high-temperature solder paste, BiAgX® at the China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21, in Hefei, Anhui, China.