Communiqués de presse

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will present at BIT's 5thAnnual World Congress of Smart Materials, March 6-8 in Rome, Italy. 

Indium Corporation has released a new halogen-free, no-clean ROL0 flux specifically developed for PCB assembly hand soldering and rework applications.  TACFlux® 020B-RC passes SIR

Indium Corporation expert Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the Automotive Meets Electronics conference from March 12-13 in

Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials,will present at the Semi-Therm 35thAnnual Symposium & Exhibit, March 18-22, in San Jose, Calif.,

Indium Corporation advisor and founder/principal of DS&A LLC, David Saums, will present at TestConX 2019 from March 3-6, in Mesa, Arizona, USA. Saumswill

Indium Corporation will feature its unique solid/liquid hybrid metal thermal interface materials — m2TIM™ — during the Semi-Therm 35thAnnual Symposium & Exhibit, March

Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring®and HSMF-OS, at TestConX on March 3-6 in Mesa,

Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide

Indium Corporation is proud to announce the promotion of three employees to high-level positions in their respective departments.  Scott Pringle has been promoted to Business Unit Vice

Indium Corporation will give IPC APEX Expo conference attendees numerous opportunities to witness the company's proven products live on the show floor, as well as an

Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award. Indium Corporation’s Silver Quill Award program recognizes individuals who have authored

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, was honored with a Best Paper Award from IMAPS’ 51st International Symposium on Microelectronics,

Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, and Jonas Sjoberg, Associate Director – Global Tech Services, will present at Pan Pacific Microelectronics

Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials, will present on liquid metal interface technology during IMAPS France’s 14th European

Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31. The following technical papers from Indium

Indium Corporation is one of the first soldering materials suppliers to earn IATF-16949:2016 management system certificates for its Global Headquarters and solder paste, flux, and preform

Indium Corporation will observe the 15th anniversary of its “Live@APEX” program in 2019, featuring its proven products live on the show floor throughout IPC APEX

Indium Corporation’s Andy Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will share his expertise at a TechSearch International’s

Indium Corporation’s Fiona Chen, Manager of Research & Development, will deliver a presentation at ELEXCON 2018, December 20-22 in Shenzhen, China. Chen will present on the topic

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry knowledge and expertise at the 2018 Global Minor Metals Forum on Nov. 28 in Kunming,

Indium Corporation earned the Mexico Technology Award for its Indium10.1HF Solder Paste. The Mexico Technology Awards, sponsored by Mexico EMS, recognizes the best