Comunicados de imprensa

May 19, 2016

Especialista da Indium Corporation apresenta-se na mesa redonda de tecnologia de limpeza de PCB da SMTA Silicon Valley

Indium Corporation’s Sehar Samiappan, Regional Manager for Northern California, presented Pb-Free Flux Technology and Influence on Cleaning at the SMTA Silicon Valley Chapter’s PCB

May 3, 2016

Bastow, da Indium Corporation, é um dos primeiros a obter a recertificação dos processos SMT

Indium Corporation’s Eric Bastow, Assistant Technical Manager, has become one of only a handful of technologists to earn a re-certification of the Surface Mount Technology

April 28, 2016

Indium Corporation Expert to Share Expertise at IMAPS New England Symposium, Expo

Indium Corporation’s Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will co-chair a technical session at the International

April 28, 2016

Indium Corporation Features High-Reliability, Low-Voiding Flux Coating for Solder Preforms at IMS2016

Indium Corporation will feature LV1000 solder preform flux coating at the IEEE International Microwave Symposium (IMS2016) May 22-27 in San Francisco, Calif.  LV1000 is a

April 27, 2016

Indium Corporation’s Germanium Reclaim and Recycle Program Optimizes Process Efficiency

Indium Corporation's germanium reclaim and recycle program enables customers to increase their return on materials by providing credit for diverting spent germanium from the waste stream.

April 26, 2016

Indium Corporation VP of Technology to Host Webtorials May 17 & 19

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will instruct an SMTA Webtorial from 1-2 p.m. on May 17 and 19. Dr. Lee’s webtorial, Low-Temperature Solders: New

April 21, 2016

Indium Corporation Expert to Present at SEMICON Southeast Asia

Indium Corporation’s Kenny Chiong, Senior Technical Support Engineer, will present Ultra-low Residue, No-Clean Material for Advanced Packaging Assembly at SEMICON Southeast Asia, on April 26-28

April 21, 2016

Indium Corporation Expert Presents at SMTA ICSR 2016

Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the International Conference on Soldering and Reliability (ICSR) 2016 on May 9-11

April 21, 2016

Indium Corporation Announces Karch as Regional Technical Manager for Germany, Austria and Switzerland

Indium Corporation has hired Andreas Karch as Regional Technical Manager, Germany, Austria and Switzerland. Karch provides support, including sharing process knowledge and making technical

April 19, 2016

Indium Corporation Features High-Purity Indium at SVC

Indium Corporation will feature its high-purity indium at the Society of Vacuum Coaters 2016 Technical Conference (SVC TechCon) May 9-13 in Indianapolis, Ind. High-purity

April 14, 2016

Indium Corporation’s Thum to Present at IPC Thailand

Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present Risk of No-Clean Flux Not Fully Dried Under Component Terminations at IPC Thailand on

April 12, 2016

Indium Corporation’s New Indium10.2HF Solder Paste Delivers Superior ICT Performance

Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges.

April 7, 2016

Lasky, da Indium Corporation, fará uma apresentação nas reuniões da SMTA

Indium Corporation’s Dr. Ron Lasky, Senior Technologist, will present at two upcoming SMTA regional forums: SMTA Intermountain Expo & Tech Forum on April 7 in Boise, Idaho; and SMTA

April 6, 2016

Indium Corporation’s Indium8.9HF Solder Paste Series Technology Solution to Avoid the Void

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany. The Indium8.9HF

April 5, 2016

Indium Corporation Features InFORMS Reinforced Solder Preforms at PCIM

Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at PCIM Europe, May 10-12 in Nuremberg, Germany. InFORMS are reinforced solder

March 29, 2016

Indium Corporation Names Hults as Global Accounts Manager

Indium Corporation announces the promotion of Tim Hults to Global Accounts Manager. Hults works closely with other members of the Indium Corporation team to coordinate global resources

March 23, 2016

Indium Corporation Accepting Summer Internship Program Applications for 10 Open Positions

Indium Corporation, Utica's Technology Company®, is now accepting applications for the company's college Internship Program. The following paid, full-time positions are open for

March 22, 2016

A nova tecnologia de pasta de solda Indium10.8HF da Indium Corporation apresenta o melhor desempenho aberto não húmido da sua classe

Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic

March 17, 2016

Indium Corporation VP of Technology to Present at SMT Hybrid Packaging

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg, Germany. Dr.

March 15, 2016

Indium Corporation Promotes Schachtler, Clark

Indium Corporation, Utica’s Technology Company®, announces the promotions of Theresa Schachtler to Supervisor of Sales Administration and Lisa Clark to Inside Sales Supervisor. Schachtler

March 15, 2016

Pastas de solda de baixo deslizamento da Indium Corporation em destaque na IPC APEX 2016

Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing