Communiqués de presse

Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges.

Indium Corporation’s Dr. Ron Lasky, Senior Technologist, will present at two upcoming SMTA regional forums: SMTA Intermountain Expo & Tech Forum on April 7 in Boise, Idaho; and SMTA

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany. The Indium8.9HF

Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at PCIM Europe, May 10-12 in Nuremberg, Germany. InFORMS are reinforced solder

Indium Corporation announces the promotion of Tim Hults to Global Accounts Manager. Hults works closely with other members of the Indium Corporation team to coordinate global resources

Indium Corporation, Utica's Technology Company®, is now accepting applications for the company's college Internship Program. The following paid, full-time positions are open for

Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg, Germany. Dr.

Indium Corporation, Utica’s Technology Company®, announces the promotions of Theresa Schachtler to Supervisor of Sales Administration and Lisa Clark to Inside Sales Supervisor. Schachtler

Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing

Indium Corporation has been named winner of the annual CIRCUITS ASSEMBLY Service Excellence Award for Materials at IPC APEX Expo on March 15 in Las Vegas,

Indium Corporation will be running its low-voiding solder products “Live@APEX” in partner booths throughout IPC APEX Expo on March 15-17 in Las Vegas, Nev.

Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China on March 14, 2016, in Shanghai, China. Lim’s

Indium Corporation announces the promotions of Sze Pei Lim to Regional Product Manager for Semiconductor Products in Asia and Jonas Sjoberg to Technical Manager for Asia. Lim

Indium Corporation’s Wolfgang Bloching, Regional Sales Manager – Germany, Austria, and Switzerland, will present at the EPP Innovations Forum on March 10 in Böblingen,

Indium Corporation announces the release of PoP Flux 89LV-P, a bright pink-colored, no-clean, thixotropic flux that helps engineers to Avoid the Void™ by greatly improving visual

Indium Corporation will feature "Power-Safe" NC-SMQ®75, the world's first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power

Indium Corporation will feature Indium3.2HF water-soluble solder paste at Productronica China on March 15-17, 2016, at the Shanghai New International Expo Centre in Shanghai, China. Indium3.2HF is an

Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev. Dr. Lee will give his

Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void®, while delivering high transfer efficiency with low

Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, Calif. Indium