Indium Corporation's Ed Briggs, senior technical support engineer, will present at the SMTA Space Coast and Tampa Bay Expo & Tech Forum on Dec. 4 in Kissimmee, Fla.
Briggs' presentation, Meeting Future Stencil Printing Challenges with Ultra-Fine-Powder Solder Pastes, discusses a statistical comparison of the transfer efficiency of different solder powder particle sizes, specifically types 3, 4, 5, and 6; and reviews observations of post-reflow results in both harsh and optimal conditions.
Briggs is an SMTA-certified process engineer. He earned his associate degree in chemical technology from Mohawk Valley Community College, where he received the Douglas J. Bauer Award for Excellence in Chemistry. In addition, he earned his Six Sigma Green Belt from Dartmouth College. Briggs joined Indium Corporation in 1990 and has held a variety of positions in production and technical support.
For more information about the SMTA Space Coast and Tampa Bay Expo & Tech Forum, visit www.smta.org.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, energia solar, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
