Indium Corporation's Ed Briggs, senior technical support engineer, will present at the SMTA Space Coast and Tampa Bay Expo & Tech Forum on Dec. 4 in Kissimmee, Fla.
Briggs' presentation, Meeting Future Stencil Printing Challenges with Ultra-Fine-Powder Solder Pastes, discusses a statistical comparison of the transfer efficiency of different solder powder particle sizes, specifically types 3, 4, 5, and 6; and reviews observations of post-reflow results in both harsh and optimal conditions.
Briggs is an SMTA-certified process engineer. He earned his associate degree in chemical technology from Mohawk Valley Community College, where he received the Douglas J. Bauer Award for Excellence in Chemistry. In addition, he earned his Six Sigma Green Belt from Dartmouth College. Briggs joined Indium Corporation in 1990 and has held a variety of positions in production and technical support.
For more information about the SMTA Space Coast and Tampa Bay Expo & Tech Forum, visit www.smta.org.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
