Indium Corporation's Sze Pei Lim, Regional Product Manager, will present on soldering material technology for heterogeneous integration at SEMICON China, June 26-29 in Shanghai.
The development of heterogeneous integration, which packs more dies or components into a smaller footprint, requires multiple technological advancements in various aspects of advanced packaging, such as substrate design, interconnect methods, and materials. In Soldering Material Evolution for Heterogeneous Integration, Lim will outline trends in various soldering material technology for heterogeneous integration, including solder paste, flip-chip, and ball-attach fluxes.
Lim manages the semiconductor product lines for the Asia region and works closely with the internal sales and research and development (R&D) teams to develop solutions for industry needs and requirements. She also collaborates with external customers and corporate partners to support the industry's move toward heterogeneous integration.
Some of her recent work includes the development of materials and processes for advanced packaging for fine-feature printing for SiP application, as well as for one-step OSP ball-attach applications. Lim has more than 25 years of experience, specifically in the areas of PCB assembly and surface mount technology. She joined Indium Corporation in 2007 as a Technical Manager in Southeast Asia. Prior to that, she was a Research and Development Chemist, focusing on solder paste and flux formulation. Lim earned her bachelor's degree from the National University of Singapore, where she majored in industrial chemistry with a focus in polymers. She is a Certified SMT Process Engineer, has earned her Six Sigma Green Belt designation, and is heavily involved in many research and road mapping organizations.
To view additional papers authored by Indium Corporation's experts, visit indiumstg.wpenginepowered.com/techlibrary.
Indium Corporation là nhà sản xuất và cung cấp vật liệu hàng đầu cho các thị trường điện tử, bán dẫn, màng mỏng và quản lý nhiệt toàn cầu. Các sản phẩm bao gồm chất hàn và chất trợ dung; hàn đồng; vật liệu giao diện nhiệt; mục tiêu phun; kim loại indium, gali, germani và thiếc và các hợp chất vô cơ; và NanoFoil ® . Được thành lập vào năm 1934, công ty có hỗ trợ kỹ thuật toàn cầu và các nhà máy đặt tại Trung Quốc, Ấn Độ, Malaysia, Singapore, Hàn Quốc, Vương quốc Anh và Hoa Kỳ.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
