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Indium Corporation has released Indium11.8HF-SPR (T5-MC) Solder Paste a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of

Indium Corporation’s Joey Qiao, Area Technical Manager for Eastern China, will share his technical expertise at the IPC Electronics Assembly High Reliability Technical

Indium Corporation will feature its ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void®—at the SMTA International Technical Conference,

Indium Corporation will partner with 3S Silicon Tech, Inc. to host a technology seminar on solder joint reliability for automotive electronics on Aug. 11 in Taiwan

Indium Corporation has named Jerry Zhao as Semiconductor Sales Manager, China. Zhao provides strategic direction to Indium Corporation’s core semiconductor team in China. He also develops

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at NEPCON South China 2017, Aug. 29-31 in Shenzhen, China. Indium Corporation is redefining

Indium Corporation’s Andy Wei, PCBA Product Manager for China, will share his technical expertise at the IPC WorksAsia Technical Conference (Shenzhen) on June 23 in Shenzhen,

Indium Corporation’s Jason Chou, Area Technical Manager for Taiwan, will share his technical expertise at Microelectronics Tech Asia Singapore, July 4-5, 2017 in Singapore. Chou will

Indium Corporation has published 35 technical articles, 24 blog posts, and 14 videos to help members of the global electronics assembly industry solve voiding challenges. “Voiding is one

Indium Corporation’s Pony Liao, Area Technical Manager for Northern China, will share his technical expertise at the CEIA Qingdao Seminar on June 23 in Qingdao, Shandong,

Indium Corporation's Pat Ryan, Worldwide Strategic Sales Consultant, was awarded a Lifetime Achievement award at the Intermountain Boise Expo & Tech Forum in Boise, Idaho. The

Indium Corporation, Utica's Technology Company®, has named Joshua Wake as Associate Controller. Wake works closely with the finance team to enhance the internal control environment and

Indium Corporation will feature its WS-575-C Ball-Attach Flux at Microelectronics Tech Asia Singapore, July 4-5, 2017 in Singapore. Indium Corporation’s WS-575-C Ball-Attach

Indium Corporation will feature its semiconductor-grade gold-germanium solder preforms at IMAPS High Temperature Electronics Network 2017 (HiTEN 2017), July 10-12 in Cambridge, United

Indium Corporation’s Bernard Leavitt, Product Specialist, High-Temperature Applications, will present at IMAPS High Temperature Electronics Network 2017 (HiTEN 2017), July 10-12 in

Indium Corporation, Utica’s Technology Company®, announces 10 new students who comprise the company’s 2017 college Internship Program. “The goal of Indium

Indium Corporation and SMT hosted a joint seminar on May 5 in Shanghai, China featuring technical discussions on Materials and Equipment Selection for High-Reliability Automotive

Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium (CSPT) on June 21-23 in Jiangyin, China. Hu’s

Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the SMTA Empire Expo and Tech Forum on June 15 in Liverpool, NY.

Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the IMAPS Advanced Technology Workshop and

Several Indium Corporation experts will present at the SMTA International Conference on Soldering and Reliability (ICSR) 2017 on June 6-8 in Ontario, Canada. Brook Sandy-Smith,