Communiqués de presse

Indium Corporation and SMT hosted a joint seminar on May 5 in Shanghai, China featuring technical discussions on Materials and Equipment Selection for High-Reliability Automotive

Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium (CSPT) on June 21-23 in Jiangyin, China. Hu’s

Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the SMTA Empire Expo and Tech Forum on June 15 in Liverpool, NY.

Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the IMAPS Advanced Technology Workshop and

Several Indium Corporation experts will present at the SMTA International Conference on Soldering and Reliability (ICSR) 2017 on June 6-8 in Ontario, Canada. Brook Sandy-Smith,

Indium Corporation’s Ivan Castellanos, Technical Service Manager for Latin America, will present at InnovationsFORUM Mexico on June 14 in Guadalajara, Mexico. Castellanos’

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared insights into the global supply and demand for indium at the 10th World Indium & Germanium &

Indium Corporation and Yunnan Tin Group Company Limited have developed a strategic technology and materials partnership to supply indium-based products to the Chinese electronics and flat panel

Indium Corporation will feature its MEMS microphone lid-attach Indium8.9HF Solder Paste at MEPTEC’s 15th Annual MEMS and Sensors Technology Symposium on June 6, in San

Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the InnovationsFORUM Hungary on May 25 in Budapest, Hungary.

Indium Corporation's Dr. Ron Lasky, Senior Technologist, and Eric Bastow, Assistant Technical Manager for the Americas, will present at the 2017 SMTA Puget Sound Symposium and

Indium Corporation will feature its void-reducing Indium8.9HF and Indium10.1 Solder Pastes to help customers Avoid the Void® at NEPCON China 2017 from April 25-27, in

Indium Corporation and SMT will host a joint seminar on May 5 in Shanghai featuring technical discussions on Materials and Equipment Selection for High-Reliability Automotive

Indium Corporation featured its low-voiding solder products “Live@Productronica China” at Productronica China from March 14-16, 2017, in Shanghai.      

Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the RF and Microwave Packaging (RaMP) 2017 Workshop on April 26-27,

Indium Corporation, Utica’s Technology Company®, has promoted Brandon Judd and hired Benjamin Rolewicz and Mike Wood as Manufacturing Process Engineers at the company’s Business Park

Indium Corporation will feature its reclaim and recycle program at the Society of Vacuum Coaters 2017 Technical Conference (SVC TechCon) April 29-May 4 in Providence,

Indium Corporation's Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the 2017 Automotive Electronics Council (AEC)

Indium Corporation delivers a single-source solution, from mine to packaging, for high-purity tin materials. The company offers tin in a number of physical forms and purity levels of up to 5N or

Indium Corporation's Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at PCIM Europe 2017 and SMT Hybrid Packaging on May 16

Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at ICEP 2017 on April 19-22 in Tendo, Japan. Lim’s presentation, Benchmarking Study for