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May 1, 2014

Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes

Indium Corporation’s Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. The

April 23, 2014

Indium Corporation Features Heat-Spring Thermal Interface Material at PCIM

Indium Corporation will feature its Heat-Spring® Thermal Interface Material at PCIM May 20-22 in Nuremberg, Germany. Heat-Spring® is a patented technology designed to deliver superior

April 23, 2014

Indium Corporation zeigt das Wärmeleitmaterial „Heat-Spring“ auf der PCIM

Die Indium Corporation zeigt ihr Wärmeleitmaterial Heat-Spring vom 20. bis 22. Mai auf der PCIM in Nürnberg, Deutschland. Heat-Spring ist eine patentierte Technologie, die entwickelt wurde,

April 17, 2014

Indium Corporation Technology Experts to Present at IMAPS New England

Indium Corporation technology experts will serve as session chair and give a poster presentation at IMAPS New England May 6 in Boxborough, Mass. Derrick Herron, technical support engineer, will give

April 15, 2014

Indium Corporation Features Indium, Gallium, and Germanium Materials at SVC Technical Conference

Indium Corporation will feature their indium, gallium and germanium metals and compounds at the SVC Technical Conference May 6-7 in Chicago, IL. Indium Corporation supplies high-purity indium,

April 11, 2014

Indium Corporation Technology Expert to Present at SMTA Intermountain

Indium Corporation’s Greg Wade, technical support engineer – global accounts, will present at the regional SMTA expo in Boise, Idaho on April

April 8, 2014

Indium Corporation Vice President of Technology to Present at IWWPE

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present at the International Workshop on WGB Power Electronics April 10-11 in Hsinchu, Taiwan. Dr. Lee will present

April 3, 2014

Indium Corporation Features SACm at NEPCON China

Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China. SACm™ is a high-reliability, low-cost solder paste that offers drop test performance far

April 3, 2014

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April 2, 2014

Indium Corporation Technology Experts to Present at Southeast Asia Technical Conference

Indium Corporations Dr. Ning-Cheng Lee, vice president of technology; Sze Pei Lim, technical manager Southeast Asia; and Sehar Samiappan, area technical manager will present at the SMTA Southeast

March 25, 2014

Indium Corporation Celebrates 10th Anniversary of Live at APEX

Indium Corporation is pleased to announce the 10th anniversary of its Live at APEX program. Live at APEX is the joint effort of Indium Corporation and its industry

March 18, 2014

Indium Corporation Recognized by State, Local Leaders for 80 Years in Business

CLINTON, N.Y. – Several local and state officials recognized Indium Corporation Thursday, March 13, for the company’s 80 years of achievement. The day was also proclaimed Indium

March 13, 2014

Indium Corporation Experts Reflect on 80 Years of Technology Innovation and Growth

CLINTON, NY – What does it take to make it to 80 years in an industry where today’s technology is obsolete tomorrow? For Indium Corporation, it takes foresight and dedication.

March 12, 2014

Indium Corporation Promotes Anne Bazan to Senior Marcom Specialist

Indium Corporation announces that Anne Bazan has been promoted to senior marcom specialist. Anne joined Indium Corporation in 2011 as a part-time assistant coordinator and was promoted to a full-time

March 11, 2014

Indium Corporation Hires Associate Director for Sales and Marketing for Asia-Pacific Region

Indium Corporation announces that Tony Teo has been hired as Associate Director for Sales and Marketing for the Asia-Pacific region, including China. Teo’s primary responsibility is to continue

March 11, 2014

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March 7, 2014

Indium Corporation Product Specialist to Present at IMAPS Device Packaging

Indium Corporation’s Maria Durham, product specialist for semiconductor and advanced assembly materials, will present at the IMAPS Device Packaging conference on Tuesday, March 11 in

March 5, 2014

Ryan của Indium Corporation sẽ trình bày tại cuộc họp kỹ thuật SMTA Intermountain

Indium Corporation’s Americas Sales Manager Pat Ryan will present at the SMTA Intermountain Chapter’s technical meeting on March 6 in Logan, Utah. Ryan’s presentation, What’s

March 4, 2014

Indium Corporation Features BiAgX New, High Temperature, Lead-Free Solder Paste Technology at Semicon China

Indium Corporation will feature its new high-melting lead-free solder paste technology, BiAgX®, at Semicon China on March 18-20 in Shanghai, China. BiAgX® was created specifically for

March 4, 2014

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