Communiqués de presse

Indium Corporation’s Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in

Indium Corporation announces that Jim MacPherson has been promoted to assistant plant manager for the company’s Business Park Drive facility in Utica. MacPherson’s expanded

Indium Corporation and Kyzen hosted a technical seminar on April 29 in Hsinchu, Taiwan. The seminar featured presentations by Sze Pei Lim, Indium Corporations technical manager for Southeast Asia,

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Indium Corporation‘s Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Electronic Components and Technology Conference (ECTC) May 27-30 in

Indium Corporation’s Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23.  Wilson’s presentation, Elimination of Head-in-Pillow in PoP

Indium Corporation’s Ed Briggs, senior technical support engineer, will present at the International Conference on Soldering and Reliability Wednesday, May 14 in Toronto,

Indium Corporation technology experts will present at the IPC Southeast Asia High Reliability Conference May 28 in Singapore. Sze Pei Lim, technical manager for Southeast Asia, will present Voiding

Indium Corporation will feature SACm™ solder paste at SMT Hybrid Packaging May 6-8 in Nuremberg, Germany. SACm™ is a high-reliability solder paste that increases the drop-shock

Indium Corporation zeigt ihre hochzuverlässige Weichlötpaste SACm vom 6. bis 8. Mai auf der SMT Hybrid Packaging in Nürnberg, Deutschland. SACm ist eine hochzuverlässige

Indium Corporation technology experts will present at PCIM Europe May 20–22 in Nuremberg, Germany. Karthik Vijay, technical manager for Europe, Africa, and the Middle East, will present Void

Während der PCIM Europe vom 20. bis 22 Mai werden erfahrene Technologen von Indium Corporation Vorträge halten. Karthik Vijay, Technischer Leiter für Europa, Afrika, und den Mittleren

Indium Corporation’s Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. The

Indium Corporation will feature its Heat-Spring® Thermal Interface Material at PCIM May 20-22 in Nuremberg, Germany. Heat-Spring® is a patented technology designed to deliver superior

Die Indium Corporation zeigt ihr Wärmeleitmaterial Heat-Spring vom 20. bis 22. Mai auf der PCIM in Nürnberg, Deutschland. Heat-Spring ist eine patentierte Technologie, die entwickelt wurde,

Indium Corporation technology experts will serve as session chair and give a poster presentation at IMAPS New England May 6 in Boxborough, Mass. Derrick Herron, technical support engineer, will give

Indium Corporation will feature their indium, gallium and germanium metals and compounds at the SVC Technical Conference May 6-7 in Chicago, IL. Indium Corporation supplies high-purity indium,

Indium Corporation’s Greg Wade, technical support engineer – global accounts, will present at the regional SMTA expo in Boise, Idaho on April

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present at the International Workshop on WGB Power Electronics April 10-11 in Hsinchu, Taiwan. Dr. Lee will present

Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China. SACm™ is a high-reliability, low-cost solder paste that offers drop test performance far

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