Wave Flux

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Wave Flux
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Indium Corporation offers a full line of competitive, state-of-the-art wave solder fluxes for electronics assembly. We are the first company to introduce halogen-free, Pb-free wave fluxes that perform as well as the more established halogen-containing tin-lead wave fluxes.

All wave solder fluxes are available in 55-gallon (200 liter), 5-gallon, and 1-gallon containers.

Wave fluxes include:

In addition, we provide bar solders in:

Sn63
Sn60
SAC305
SAC4307
Sn992
Sn995

Related Markets and Applications

Wave Flux Technical Documents

Whitepapers

Application Notes

Storage and Handling of Specialty Fluxes (Letter)

Product Data Sheets

1025 Water-Soluble Flux (Letter)

1072 VOC-Free Flux (Letter)

1075-EX VOC-Free Flux (Letter)

1075-EX-30 VOC-Free Flux (Letter)

1075-EXR-30 VOC-Free Flux (Letter)

1075-EXR-40 VOC-Free Flux (Letter) (A4)

1075-EXR-44 VOC-Free Flux (Letter)

1076-30 VOC-Free Flux (Letter)

1081 T Wave Solder Flux (Letter)

1081 Water-Soluble, Halide-Free Flux (Letter)

1095-NF Water Soluble Flux (Letter)

14 Rosin Flux (Letter)

2036 Non-Activated Rosin Flux (Letter)

2205 Rosin Flux (Letter)

2632 Soldering Flux (Letter)

3577-TF No-Clean Flux (Letter)

3590-T No-Residue Flux (Letter)

3590-TX No-Residue Flux (Letter)

3592 No-Residue (Letter)

42-SS Soldering Flux (Letter)

Bar Solder (Letter)

NR-10-D Wave Solder Flux (Letter)

Sn992 Pb-Free Soldering Alloy (Letter)

SN995 Pb-Free Soldering Alloy (Letter)

Wave Solder Flux #1010 Water-Soluble (Letter)

Wave Solder Flux #1075 VOC-Free (Letter)

Wave Solder Flux #2212 Series (Letter)

Wave Solder Flux #3541 No-Clean (Letter)

Wave Solder Flux #66 (Letter)

WF-7742 VOC-Free Wave Solder Flux (Letter) (A4)

WF-7745 Wave Solder Flux (Letter)

WF-9940 (Letter) (A4)

WF-9942 No-Residue (Letter) (A4)

WF-9945 Halogen-Free Wave Solder Flux (Letter) (A4)

WF-9948 Wave Solder Flux (Letter)

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Material Safety Data Sheets

Flux Blog Posts

Reflow of Copper Pillar Microbumps

Monday, June 10, 2013 by Dr. Andy Mackie [view bio]

Waferbumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste printing (with all its concerns of voiding, coplanarity, stencil-life, and spatter) to plated solderbumps, and now to plated copper pillars with microbumps…

NanoBond® is a Fluxless Process

Thursday, May 16, 2013 by Jim Hisert [view bio]

Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux for removing oxides from any solderable surface. Even though we love fluxes at Indium Corporation – not all of our customers share that same affection. It…

The Magic of Engineered Solders

Friday, April 05, 2013 by Seth Homer [view bio]

Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or connector assembly application. The possibilities are endless. One of my personal favorite engineered solders is Solder Fortification® Preforms.…

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