In celebration of Indium Corporation’s 85thanniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49thelement.
Indium Corporation is the global leader for indium metal and associated technologies. Because of its unique properties with virtually limitless applications, indium metal is literally all around us.
Indium metal, specifically foil made of pure indium, InSn, InAg, and pure indium clad with aluminum, efficiently removes process heat, making it a preferred choice for burn-in and test.
Since pure indium is more likely to stick to the burn-in head, a very thin cladding of aluminum is used to reduce the sticking. It is much more expensive to test at the board level—after the components have been soldered to the board—than to test each individual chip.
Indium Corporation’s Heat-Spring® thermal interface material (TIM) is designed to be used as an interface between a heat source and a heat-sink, heat-spreader, or heat-pipe. The malleability of indium metal maximizes the Heat-Spring’s thermal resistance and enhances cooling.
For more information on indium metal, visit www.indium.com/indium49.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.
