In celebration of Indium Corporation’s 85thanniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49thelement.
Indium Corporation is the global leader for indium metal and associated technologies. Because of its unique properties with virtually limitless applications, indium metal is literally all around us.
Indium metal, specifically foil made of pure indium, InSn, InAg, and pure indium clad with aluminum, efficiently removes process heat, making it a preferred choice for burn-in and test.
Since pure indium is more likely to stick to the burn-in head, a very thin cladding of aluminum is used to reduce the sticking. It is much more expensive to test at the board level—after the components have been soldered to the board—than to test each individual chip.
Indium Corporation’s Heat-Spring® thermal interface material (TIM) is designed to be used as an interface between a heat source and a heat-sink, heat-spreader, or heat-pipe. The malleability of indium metal maximizes the Heat-Spring’s thermal resistance and enhances cooling.
For more information on indium metal, visit indiumstg.wpenginepowered.com/indium49.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
