In celebration of Indium Corporation’s 85thanniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49thelement.
Indium Corporation is the global leader for indium metal and associated technologies. Because of its unique properties with virtually limitless applications, indium metal is literally all around us.
Indium metal, specifically foil made of pure indium, InSn, InAg, and pure indium clad with aluminum, efficiently removes process heat, making it a preferred choice for burn-in and test.
Since pure indium is more likely to stick to the burn-in head, a very thin cladding of aluminum is used to reduce the sticking. It is much more expensive to test at the board level—after the components have been soldered to the board—than to test each individual chip.
Indium Corporation’s Heat-Spring® thermal interface material (TIM) is designed to be used as an interface between a heat source and a heat-sink, heat-spreader, or heat-pipe. The malleability of indium metal maximizes the Heat-Spring’s thermal resistance and enhances cooling.
For more information on indium metal, visit www.indium.com/indium49.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
