Indium Corporation will partner with 3S Silicon Tech, Inc. to host a technology seminar on solder joint reliability for automotive electronics on Aug. 11 in Taiwan Hsinchu.
Technical experts from both companies will detail high-reliability technology and materials for automotive electronics applications, including:
- High-reliability alloys and low-temperature solders
- Reliable materials for SiP applications
- Power semiconductor developments and applications in the automotive market
- Vacuum oven reflow technology and applications
For registration details, contact Tommy at [email protected].
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.
3S is a total solutions provider of die bonding in discrete power devices. 3S was established in 1998, headquartered in Hsinchu, with branch offices and sales offices in Shanghai, Singapore, Philippines and Malaysia.
