Indium Corporation will partner with 3S Silicon Tech, Inc. to host a technology seminar on solder joint reliability for automotive electronics on Aug. 11 in Taiwan Hsinchu.
Technical experts from both companies will detail high-reliability technology and materials for automotive electronics applications, including:
- High-reliability alloys and low-temperature solders
- Reliable materials for SiP applications
- Power semiconductor developments and applications in the automotive market
- Vacuum oven reflow technology and applications
For registration details, contact Tommy at [email protected].
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
3S is a total solutions provider of die bonding in discrete power devices. 3S was established in 1998, headquartered in Hsinchu, with branch offices and sales offices in Shanghai, Singapore, Philippines and Malaysia.
