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Indium Corp. to Host August Technology Seminar on Solder Joint Reliability for Automotive Electronics in Taiwan Hsinchu

Indium Corporation will partner with 3S Silicon Tech, Inc. to host a technology seminar on solder joint reliability for automotive electronics on Aug. 11 in Taiwan Hsinchu.

Technical experts from both companies will detail high-reliability technology and materials for automotive electronics applications, including:

  • High-reliability alloys and low-temperature solders
  • Reliable materials for SiP applications
  • Power semiconductor developments and applications in the automotive market
  • Vacuum oven reflow technology and applications

For registration details, contact Tommy at [email protected].

Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物,以及 NanoFoil®。Indium 成立於 1934 年,擁有全球性的技術支援,工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。

如需更多關於 Indium Corporation 的資訊,請造訪www.indium.com或寄電子郵件[email protected]您也可以透過www.facebook.com/indium@IndiumCorp 追蹤我們的專家,From One Engineer ToAnother®(#FOETA)。

3S is a total solutions provider of die bonding in discrete power devices. 3S was established in 1998, headquartered in Hsinchu, with branch offices and sales offices in Shanghai, Singapore, Philippines and Malaysia.