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Indium Corp. to Host August Technology Seminar on Solder Joint Reliability for Automotive Electronics in Taiwan Hsinchu

Indium Corporation will partner with 3S Silicon Tech, Inc. to host a technology seminar on solder joint reliability for automotive electronics on Aug. 11 in Taiwan Hsinchu.

Technical experts from both companies will detail high-reliability technology and materials for automotive electronics applications, including:

  • High-reliability alloys and low-temperature solders
  • Reliable materials for SiP applications
  • Power semiconductor developments and applications in the automotive market
  • Vacuum oven reflow technology and applications

For registration details, contact Tommy at [email protected].

铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂;硬钎焊;热界面材料;溅射靶材;铟、镓(Ga)、锗和锡等金属及化合物;以及NanoFoil®。铟泰公司成立于1934年,拥有全球技术支持网络,并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。

如需了解铟泰公司更多信息,请访问indiumstg.wpenginepowered.com或发送电子邮件[email protected]。您还可以通过www.facebook.com/indium@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”(#FOETA)。

3S is a total solutions provider of die bonding in discrete power devices. 3S was established in 1998, headquartered in Hsinchu, with branch offices and sales offices in Shanghai, Singapore, Philippines and Malaysia.