Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Testing and Marketing Conference (CSPT 2019), September 8-10, in Wuxi, China.
Hu’s presentation, Novel Water-Soluble Flux Study for Heterogeneous Integration Assembly, will detail a high-viscosity, high-tack flux designed to be used to secure components at the placement and reflow stage allowing the flux residue to be cleaned. Hu will also present the characteristics and strengths of the developed flux, WS-446HF, including its excellent wetting, low voiding performance, and elimination of dendritic residues.
Hu is based in Suzhou, China, and has nearly 15 years of experience in semiconductor packaging. He is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. He has served in many roles at top 10 outsourced assembly and test (OSAT) companies, including Process Engineer, Project Engineer, Senior R&D Engineer, and Chief Engineer. Hu earned his bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
For more information on Indium Corporation’s materials for heterogeneous integration, visit www.indium.com/HIA or visit Indium Corporation’s booth.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.
