Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Testing and Marketing Conference (CSPT 2019), September 8-10, in Wuxi, China.
Hu’s presentation, Novel Water-Soluble Flux Study for Heterogeneous Integration Assembly, will detail a high-viscosity, high-tack flux designed to be used to secure components at the placement and reflow stage allowing the flux residue to be cleaned. Hu will also present the characteristics and strengths of the developed flux, WS-446HF, including its excellent wetting, low voiding performance, and elimination of dendritic residues.
Hu is based in Suzhou, China, and has nearly 15 years of experience in semiconductor packaging. He is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. He has served in many roles at top 10 outsourced assembly and test (OSAT) companies, including Process Engineer, Project Engineer, Senior R&D Engineer, and Chief Engineer. Hu earned his bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
For more information on Indium Corporation’s materials for heterogeneous integration, visit www.indium.com/HIA or visit Indium Corporation’s booth.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
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