Indium Corporation’s Jeffrey Len, Technical Support Engineer, will share his expertise at the SMTA Southeast Asia Technical Conference on Electronics Assembly on Tuesday, May 22, at the Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia.
Len will present Impact of Stencil Quality on Solder Paste Printing Performance. Noting the increasing packaging and board level assembly miniaturization trends, Len will examine how stencil quality impacts the screen printing process.
Len has extensive experience in improving customer processes and developing close customer relationships to understand and service individual needs. He has comprehensive technical knowledge in the selection, use, and application of Indium Corporation’s entire range of products. Len earned his bachelor’s degree in pure chemistry from Universti Sains Malaysia in Penang, Malaysia.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
