Indium Corporation’s Jeffrey Len, Technical Support Engineer, will share his expertise at the SMTA Southeast Asia Technical Conference on Electronics Assembly on Tuesday, May 22, at the Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia.
Len will present Impact of Stencil Quality on Solder Paste Printing Performance. Noting the increasing packaging and board level assembly miniaturization trends, Len will examine how stencil quality impacts the screen printing process.
Len has extensive experience in improving customer processes and developing close customer relationships to understand and service individual needs. He has comprehensive technical knowledge in the selection, use, and application of Indium Corporation’s entire range of products. Len earned his bachelor’s degree in pure chemistry from Universti Sains Malaysia in Penang, Malaysia.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
