Indium Corporation’s Jeffrey Len, Technical Support Engineer, will share his expertise at the SMTA Southeast Asia Technical Conference on Electronics Assembly on Tuesday, May 22, at the Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia.
Len will present Impact of Stencil Quality on Solder Paste Printing Performance. Noting the increasing packaging and board level assembly miniaturization trends, Len will examine how stencil quality impacts the screen printing process.
Len has extensive experience in improving customer processes and developing close customer relationships to understand and service individual needs. He has comprehensive technical knowledge in the selection, use, and application of Indium Corporation’s entire range of products. Len earned his bachelor’s degree in pure chemistry from Universti Sains Malaysia in Penang, Malaysia.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
