Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, was honored with a Best Paper Award from IMAPS’ 51st International Symposium on Microelectronics, recently held from October 8-11, 2018, in Pasadena, California.
Dr. Lee earned a Best of Track award for his paper Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications, which reported on the development, testing, and results of Indalloy®276, a lead-free solder alloy created to target wide service temperatures with high reliability.
For a look at additional papers authored by Dr. Lee and Indium Corporation’s other industry experts, visit www.indium.com/techlibrary.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT, as well as high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.
