Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, was honored with a Best Paper Award from IMAPS’ 51st International Symposium on Microelectronics, recently held from October 8-11, 2018, in Pasadena, California.
Dr. Lee earned a Best of Track award for his paper Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications, which reported on the development, testing, and results of Indalloy®276, a lead-free solder alloy created to target wide service temperatures with high reliability.
For a look at additional papers authored by Dr. Lee and Indium Corporation’s other industry experts, visit indiumstg.wpenginepowered.com/techlibrary.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT, as well as high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Märkte für Elektronik, Halbleiter, Dünnschichten und Wärmemanagement. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
