Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, was honored with a Best Paper Award from IMAPS’ 51st International Symposium on Microelectronics, recently held from October 8-11, 2018, in Pasadena, California.
Dr. Lee earned a Best of Track award for his paper Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications, which reported on the development, testing, and results of Indalloy®276, a lead-free solder alloy created to target wide service temperatures with high reliability.
For a look at additional papers authored by Dr. Lee and Indium Corporation’s other industry experts, visit www.indium.com/techlibrary.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT, as well as high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
Para más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected]. También puede seguir a nuestros expertos, From One Engineer To Another® (#FOETA), en www.facebook.com/indium o @IndiumCorp.
