Indium Corporation experts will share their industry knowledge and skill at IMAPS 2018 from Oct. 8-11 in Pasadena, Calif.
The following technical presentations from Indium Corporation experts will be featured:
- Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications by Dr. Ning-Cheng Lee, Vice President of Technology
- Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High-Reliability Performance up to 175°C by Dr. Lee
- Fluxes Effective in Suppressing Non-Wet-Open at BGA Assembly by Dr. Lee
- Perspectives of High-Temperature Lead-Free Solders by Dr. HongWen Zhang, Manager, R&D Alloy Group
- Shear Strength and Thermo-Mechanical Reliability of Sintered Ag Joints Containing Low CTE Non-Metal Additives for Die Attach by Guangyu Fan, Research Chemist
Dr. Lee will also lead the course Achieving High-Reliability Solder Joints for Lead-Free Alloys, which will examine how various factors contribute to the overall reliability of the solder joint. The discussion will include a review of novel solder alloys designed for wide service temperature range automotive applications, as well as the mechanisms of achieving high-reliability.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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