Indium Corporation experts will share their industry knowledge and skill at IMAPS 2018 from Oct. 8-11 in Pasadena, Calif.
The following technical presentations from Indium Corporation experts will be featured:
- Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications by Dr. Ning-Cheng Lee, Vice President of Technology
- Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High-Reliability Performance up to 175°C by Dr. Lee
- Fluxes Effective in Suppressing Non-Wet-Open at BGA Assembly by Dr. Lee
- Perspectives of High-Temperature Lead-Free Solders by Dr. HongWen Zhang, Manager, R&D Alloy Group
- Shear Strength and Thermo-Mechanical Reliability of Sintered Ag Joints Containing Low CTE Non-Metal Additives for Die Attach by Guangyu Fan, Research Chemist
Dr. Lee will also lead the course Achieving High-Reliability Solder Joints for Lead-Free Alloys, which will examine how various factors contribute to the overall reliability of the solder joint. The discussion will include a review of novel solder alloys designed for wide service temperature range automotive applications, as well as the mechanisms of achieving high-reliability.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
