Indium Corporation experts will share their industry knowledge and skill at IMAPS 2018 from Oct. 8-11 in Pasadena, Calif.
The following technical presentations from Indium Corporation experts will be featured:
- Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications by Dr. Ning-Cheng Lee, Vice President of Technology
- Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High-Reliability Performance up to 175°C by Dr. Lee
- Fluxes Effective in Suppressing Non-Wet-Open at BGA Assembly by Dr. Lee
- Perspectives of High-Temperature Lead-Free Solders by Dr. HongWen Zhang, Manager, R&D Alloy Group
- Shear Strength and Thermo-Mechanical Reliability of Sintered Ag Joints Containing Low CTE Non-Metal Additives for Die Attach by Guangyu Fan, Research Chemist
Dr. Lee will also lead the course Achieving High-Reliability Solder Joints for Lead-Free Alloys, which will examine how various factors contribute to the overall reliability of the solder joint. The discussion will include a review of novel solder alloys designed for wide service temperature range automotive applications, as well as the mechanisms of achieving high-reliability.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
