Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at SEMICON Taiwan 2019, September 18-20, in Taipei, Taiwan.
WS-446HF flux is a robust, NIA (no intentionally added),halogen-free, water-wash flux that is designed to provide one simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes. It has a powerful activator system to promote good wetting on even the most demanding substrate metalizations, such asCu OSP, ENEPIG, and ENIG. WS-446HF helps to improve production yield by minimizing non-wet open defects, missing balls, and eliminating Electro-Chemical Migration (ECM).
WS-446HF:
- Promotes excellent solderability and wetting on a wide range of surfaces
- Cleans well with room temperature DI water
- Eliminates ECM or dendrite formation caused by residue
Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP and Heterogeneous Integration applications. For more information on Indium Corporation’s materials for SiP, visit www.indium.com/SiP or visit Indium Corporation’s booth #J2440.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.
