Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at SEMICON Taiwan 2019, September 18-20, in Taipei, Taiwan.
WS-446HF flux is a robust, NIA (no intentionally added),halogen-free, water-wash flux that is designed to provide one simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes. It has a powerful activator system to promote good wetting on even the most demanding substrate metalizations, such asCu OSP, ENEPIG, and ENIG. WS-446HF helps to improve production yield by minimizing non-wet open defects, missing balls, and eliminating Electro-Chemical Migration (ECM).
WS-446HF:
- Promotes excellent solderability and wetting on a wide range of surfaces
- Cleans well with room temperature DI water
- Eliminates ECM or dendrite formation caused by residue
Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP and Heterogeneous Integration applications. For more information on Indium Corporation’s materials for SiP, visit www.indium.com/SiP or visit Indium Corporation’s booth #J2440.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare il sito www.indium.com o inviare un'e-mail a [email protected]. È inoltre possibile seguire i nostri esperti, From One Engineer To Another® (#FOETA), su www.facebook.com/indium o @IndiumCorp.
