Indium Corporations Brook Sandy-Smith, Product Specialist PCB Assembly Materials, will present at the inaugural Electronic System Technologies Conference May 20-23 in Las Vegas, Nev.
Sandy-Smith will present Proven Strategies to Minimize Voiding under QFNs and other Bottom Termination Components. Her presentation will review proven approaches for eliminating QFN voiding, including solder paste optimization, process approaches, and the addition of engineered solder preforms.
Sandy-Smith serves as a technical liaison between Indium Corporations customers and internal departments, such as research and development and production, to ensure the best quality and selection of products. She earned degrees in chemical engineering, with a focus on materials, and German language from the international engineering program at the University of Rhode Island.
ESTC is a new technical conference and exhibition for the electronics industry. It covers the industry from foundry and components to board assemblies and complete systems. The conference delivers data-driven, high-quality papers by industry experts. The exhibition will showcase the latest products and services in the industry.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, energia solar, película fina e gestão térmica. Os produtos incluem soldas, pré-formas e fluxos; brasagens; alvos de pulverização; metais e compostos inorgânicos de índio, gálio e germânio; e NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
