Indium Corporations Brook Sandy-Smith, Product Specialist PCB Assembly Materials, will present at the inaugural Electronic System Technologies Conference May 20-23 in Las Vegas, Nev.
Sandy-Smith will present Proven Strategies to Minimize Voiding under QFNs and other Bottom Termination Components. Her presentation will review proven approaches for eliminating QFN voiding, including solder paste optimization, process approaches, and the addition of engineered solder preforms.
Sandy-Smith serves as a technical liaison between Indium Corporations customers and internal departments, such as research and development and production, to ensure the best quality and selection of products. She earned degrees in chemical engineering, with a focus on materials, and German language from the international engineering program at the University of Rhode Island.
ESTC is a new technical conference and exhibition for the electronics industry. It covers the industry from foundry and components to board assemblies and complete systems. The conference delivers data-driven, high-quality papers by industry experts. The exhibition will showcase the latest products and services in the industry.
Indium Corporation 是全球电子、半导体、太阳能、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料、预型件和助焊剂；钎料；溅射靶材；铟、镓和锗金属及无机化合物；以及 NanoFoil®。Indium 公司成立于 1934 年，在中国、新加坡、韩国、英国和美国拥有全球性的技术支持和工厂。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至 [email protected]。
