Indium Corporations Brook Sandy-Smith, Product Specialist PCB Assembly Materials, will present at the inaugural Electronic System Technologies Conference May 20-23 in Las Vegas, Nev.
Sandy-Smith will present Proven Strategies to Minimize Voiding under QFNs and other Bottom Termination Components. Her presentation will review proven approaches for eliminating QFN voiding, including solder paste optimization, process approaches, and the addition of engineered solder preforms.
Sandy-Smith serves as a technical liaison between Indium Corporations customers and internal departments, such as research and development and production, to ensure the best quality and selection of products. She earned degrees in chemical engineering, with a focus on materials, and German language from the international engineering program at the University of Rhode Island.
ESTC is a new technical conference and exhibition for the electronics industry. It covers the industry from foundry and components to board assemblies and complete systems. The conference delivers data-driven, high-quality papers by industry experts. The exhibition will showcase the latest products and services in the industry.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더, 프리폼 및 플럭스, 브레이즈, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
