Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at the International Microsystems Packaging Assembly and Circuits Technology conference (IMPACT) on Thursday, October 24 in Taipei, Taiwan.
Dr. Lee’s presentation, A Novel Epoxy Flux on Solder Paste for High-Reliability POP Assembly, discusses a newly-developed epoxy flux, compatible with solder paste, to address the failure of area array packages, such as BGAs, CSPs, and POP, when exposed to drop shock.
Additionally, Dr. Lee will serve on the Sustainable Manufacturing panel on October 23.
O Dr. Lee possui uma vasta experiência no desenvolvimento de pastas de solda, fluxos, polímeros de alta temperatura, encapsulantes para microeletrónica, underfills e adesivos para montagem de componentes eletrónicos. Os seus interesses de investigação atuais incluem materiais avançados para interconexões e encapsulamento em aplicações eletrónicas e optoeletrónicas, com ênfase tanto no alto desempenho como no baixo custo de propriedade. O Dr. Lee é Membro de Distinção da SMTA e membro do comité de planeamento da SMTAI.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
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