Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste at NEPCON South China, August 28-30, in Shenzhen, China.
Indium8.9HF Solder Paste is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the automotive electronics industry.
The Indium8.9HF series delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding—plus improved stability—during the printing process. Indium8.9HF:
- Demonstrates consistent printing and reflow performance for up to 12 months in refrigerated storage
- Maintains excellent printing and reflow performance after remaining at room temperature for one month
- Oferece um excelente desempenho de impressão de resposta a pausa, mesmo depois de ser deixada no estêncil durante 60 horas
With all these qualities, Indium8.9HF solder paste is able to enhance the reliability of automotive products in three ways:
- Improved thermal conductivity and thermal reliability with industry-proven low-voiding performance
- Enhanced mechanical reliability when paired with Indium Corporation’s newest high-reliability alloy, Indalloy®276, which allows for a stable and consistent performance under a harsh environment (Indalloy®276 is ideal for operating temperatures equal to or greater than 125°C)
- Higher electrical reliability with an enhanced SIR
Additionally, Indium Corporation will spotlight Indium10.1HF Solder Paste—an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in automotive applications.
For more information about Indium8.9HF and Indium10.1HF solder pastes and their use in automotive electronics, visit indiumstg.wpenginepowered.com/avoidthevoid or stop to see us at the show at booth #1K11.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
