Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste at NEPCON South China, August 28-30, in Shenzhen, China.
Indium8.9HF Solder Paste is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the automotive electronics industry.
The Indium8.9HF series delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding—plus improved stability—during the printing process. Indium8.9HF:
- Demonstrates consistent printing and reflow performance for up to 12 months in refrigerated storage
- Maintains excellent printing and reflow performance after remaining at room temperature for one month
- Ofrece un excelente rendimiento de respuesta a la pausa de impresión, incluso después de 60 horas sobre el esténcil.
With all these qualities, Indium8.9HF solder paste is able to enhance the reliability of automotive products in three ways:
- Improved thermal conductivity and thermal reliability with industry-proven low-voiding performance
- Enhanced mechanical reliability when paired with Indium Corporation’s newest high-reliability alloy, Indalloy®276, which allows for a stable and consistent performance under a harsh environment (Indalloy®276 is ideal for operating temperatures equal to or greater than 125°C)
- Higher electrical reliability with an enhanced SIR
Additionally, Indium Corporation will spotlight Indium10.1HF Solder Paste—an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in automotive applications.
For more information about Indium8.9HF and Indium10.1HF solder pastes and their use in automotive electronics, visit indiumstg.wpenginepowered.com/avoidthevoid or stop to see us at the show at booth #1K11.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
