Indium Corporation to Feature New Heat-Spring® Metal TIM at SEMI-THERM 2025

Indium Corporation^® will feature its lineup of high-reliability, low-temperature thermal interface material (TIM) products at SEMI-THERM 2025, taking place March 10-14 in San Jose, California. 

Indium Corporation will showcase the following products: 

• Heat-Spring^® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring^® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle program. 

• Heat-Spring^® HSx is a compressible, non-reflow metal TIM designed for large-area dies with warpage of 200 microns or more. It delivers 16W/m-K thermal conductivity at just 20psi, making it ideal for test heads with clamping forces of 30psi or less. Available in thicknesses from 300 microns to 1mm, it can be customized with or without a diffusion barrier to prevent die staining. 

• Solder Thermal Interface Materials deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1000 watts. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, they enhance battery life, reduce cooling fan size, and minimize heat-sink mass, all while maintaining RoHS compliance and supporting step soldering requirements. 

To learn more about Indium Corporation’s TIMs products, visit indiumstg.wpenginepowered.com/products/thermal-interface-materials/ or stop by booth #401 at the show.  

About Indium Corporation 

^A Indium^{Corporation®} é uma empresa líder na refinação, fundição, fabrico e fornecimento de materiais para os mercados globais de eletrónica, semicondutores, películas finas e gestão térmica. Os produtos incluem soldas e fluxos; ligas de brasagem; materiais de interface térmica; alvos de pulverização catódica; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e^NanoFoil®. Fundada em 1934, a empresa dispõe de apoio técnico global e fábricas localizadas na China, Alemanha, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA. 

Para mais informações sobre a Indium Corporation, visite indiumstg.wpenginepowered.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To^Another® (#FOETA), em www.linkedin.com/company/indium-corporation/.