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Indium Corporation to Feature New Heat-Spring® Metal TIM at SEMI-THERM 2025

Indium Corporation® will feature its lineup of high-reliability, low-temperature thermal interface material (TIM) products at SEMI-THERM 2025, taking place March 10-14 in San Jose, California. 

Indium Corporation will showcase the following products: 

  • Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle program. 
  • Heat-Spring® HSx is a compressible, non-reflow metal TIM designed for large-area dies with warpage of 200 microns or more. It delivers 16W/m-K thermal conductivity at just 20psi, making it ideal for test heads with clamping forces of 30psi or less. Available in thicknesses from 300 microns to 1mm, it can be customized with or without a diffusion barrier to prevent die staining. 
  • Solder Thermal Interface Materials deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1000 watts. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, they enhance battery life, reduce cooling fan size, and minimize heat-sink mass, all while maintaining RoHS compliance and supporting step soldering requirements. 

To learn more about Indium Corporation’s TIMs products, visit indiumstg.wpenginepowered.com/products/thermal-interface-materials/ or stop by booth #401 at the show.  

About Indium Corporation 

IndiumCorporation® es una empresa líder en el refinado, la fundición, la fabricación y el suministro de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Entre sus productos se incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; blancos de pulverización catódica; metales y compuestos inorgánicos de indio, galio, germanio y estaño; yNanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica a nivel mundial y fábricas situadas en China, Alemania, India, Malasia, Singapur, Corea del Sur, el Reino Unido y Estados Unidos. 

Para obtener más información sobre Indium Corporation, visita indiumstg.wpenginepowered.com o envía un correo electrónico a [email protected]. También puedes seguir a nuestros expertos, From One Engineer ToAnother® (#FOETA), en www.linkedin.com/company/indium-corporation/.