Indium Corporation® will feature its lineup of high-reliability, low-temperature thermal interface material (TIM) products at SEMI-THERM 2025, taking place March 10-14 in San Jose, California.
Indium Corporation will showcase the following products:
- Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle program.
- Heat-Spring® HSx is a compressible, non-reflow metal TIM designed for large-area dies with warpage of 200 microns or more. It delivers 16W/m-K thermal conductivity at just 20psi, making it ideal for test heads with clamping forces of 30psi or less. Available in thicknesses from 300 microns to 1mm, it can be customized with or without a diffusion barrier to prevent die staining.
- Solder Thermal Interface Materials deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1000 watts. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, they enhance battery life, reduce cooling fan size, and minimize heat-sink mass, all while maintaining RoHS compliance and supporting step soldering requirements.
To learn more about Indium Corporation’s TIMs products, visit indiumstg.wpenginepowered.com/products/thermal-interface-materials/ or stop by booth #401 at the show.
关于铟泰铟泰公司
铟泰公司®是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。您还可以通过www.linkedin.com/company/indium-corporation/ 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
