Indium Corporation’s Greg Wade, Technical Support Engineer, Global Accounts, was presented with the Committee Leadership Award by the IPC in recognition of his excellence in leadership in the development of the industry standard IPC-7526A, Stencil and Misprinted Board Cleaning Handbook.
Wade provides global technical support for Indium Corporation’s multi-national customers. He is an expert in surface mount and through-hole technologies and has more than 20 years of experience working with a number of electronics manufacturers and suppliers throughout the world. Wade is a veteran of the United States Navy and is educated in aviation RF electronics. He earned his Six Sigma Green Belt, as well as certifications on numerous equipment sets. He also holds several patents for tooling design.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.
