Indium Corporation’s Greg Wade, Technical Support Engineer, Global Accounts, was presented with the Committee Leadership Award by the IPC in recognition of his excellence in leadership in the development of the industry standard IPC-7526A, Stencil and Misprinted Board Cleaning Handbook.
Wade provides global technical support for Indium Corporation’s multi-national customers. He is an expert in surface mount and through-hole technologies and has more than 20 years of experience working with a number of electronics manufacturers and suppliers throughout the world. Wade is a veteran of the United States Navy and is educated in aviation RF electronics. He earned his Six Sigma Green Belt, as well as certifications on numerous equipment sets. He also holds several patents for tooling design.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
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